摘要：As electronic products continue to be miniaturized, the generated heat of the running chip accumulated significantly, thus heat dissipation becomes a crucial issue. According to the previous report, reducing the interface thermal resistance (ITR) and constructing the thermal conductive networking structure can effectively improve the heat transferring property of the polymer based thermal interface materials (TIMs). Here we report a polymer composite loaded with oriented carbon nanofibers which exhibit both high thermal conductivity and excellent flexibility. These nanofibers were prepared by electrospinning technique followed by a high-temperature carbonization process. The obtained well-ordered filler structure not only reduces the ITR but also build the 3D network architecture. Further, when combining with organic matrix to make the thermal gel, the through-plane thermal conductivity along the fiber direction of the composite gel increases greatly, which is as high as 0.847 W m^-1 K^-1, the strategy of using aligned and networked thermal filler in the TIMs may be a more effective way to enhance the heat dissipation of future 5G communication electronics.
© 2019 IEEE.

ISSN号：9781728150642

卷、期、页：ICEPT 2019

发表日期：2019-08-01

期刊分区（SCI为中科院分区）：三区

收录情况：EI（工程索引）

发表期刊名称：2019 20th International Conference on Electronic Packaging Technology, ICEPT 2019

参与作者：晁济,严长增,孙蓉,翁青萍

通讯作者：王英

第一作者：曹睿

论文类型：会议论文

论文概要：王英,晁济,严长增,孙蓉,曹睿,翁青萍，Oriented electrospun carbon nanofibers for improved through-plane thermal conductivity，2019 20th International Conference on Electronic Packaging Technology, ICEPT 2019，2019，ICEPT 2019

论文题目：Oriented electrospun carbon nanofibers for improved through-plane thermal conductivity